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Publications and Academic Activities

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Selected Publications

Constructing the Thermal Affective Design Space for Emotion Regulation: An Autoethnographic Research Through Design Inquiry

Feng Feng, Kim Halskov, Dan Bennett, Minna Pakanen, Elisa Mekler

ACM SIGCHI 2026 doi: 10.1145/3772318.3791565

Autonomous Regulation of Social Media Use: Implications for Self-control, Well-Being, and UX

Dan Bennett, Feng Feng, Elisa Mekler

ACM CHI’25 full paper. doi: 10.1145/3706598.3713094

Thermal Cards: From Classical Chinese Poetry to Designerly Lenses on Thermal-Affective Technology

Feng Feng, Elisa Mekler

ACM TEI’25 Pictorial. doi: 10.1145/3689050.3704419

Smiles Summon the Warmth of Spring: A Design Framework for Affective-Thermal Interaction based in Chinese Cí Poetry

Feng Feng, Dan Bennett, Elisa Mekler

ACM DIS’24 full paper. doi: 10.1145/3643834.3661620

It's Touching: Understanding Touch-Affect Association in Shape-Change with Kinematic Features

Feng Feng, Dan Bennett, Fan Zhijun, Oussama Metatla

ACM CHI’22 full paper. doi: 10.1145/3491102.3502003

Cross-Sensory Futures: Rewiring Perception in HCI

DOussama Metatla, Min S. Li, Feng Feng, Cameron Steer, Michael J. Proulx

ACM CHI’26 workshop organisation. doi:10.1145/3411763.3441321

Emergent Interaction: Complexity, Dynamics, and Enaction in HCI

Dan Bennett, Alan Dix, Parisa Eslambolchilar, Feng Feng, Tom Froese, Vassilis Kostakos, Sebastien Lerique, Niels van Berkel

ACM CHI’21 workshop organisation. doi:10.1145/3411763.3441321

Integration of Human Factors in Surgery: interdisciplinary collaboration in design, development, and evaluation of surgical technologies

Roman Bednarik, Ann Blandford, Feng Feng, Antti Huotarinen, Matti Iso-Mustajärvi, Ahreum Lee, Federico Nicolosi, Jeremy Opie, Soojeong Yoo, Bin Zheng. Accepted for CHI 2022

ACM CHI’22 workshop organisation. doi: 10.1145/3491101.3503709

Academic Leadership and Duties

Editorial Positions:

Associate Chair for Top-ranked International Conferences in CS:

International Workshop/Seminar Hosting at ACM CHI:

Review for Top-ranked International Conferences:

CHI, CSCW, DIS, Ubicomp/ISWC, Worldhaptics, Eurohaptics, ICAD

Invited Talks (Selected)

Interaction Design seminar, Aarhus 2025

Danish HCI day, Copenhagen 2024

Computer science seminar, University of Birmingham 2024

Human and Technology Group, TU Chemnitz 2022

School of Computer Science and Informatics, Cardiff University 2022

Game Group, Tempere University 2021

Department of Mechanical Engineering, Shandong University 2019